偶联剂对铜系复合涂料导电稳定性的影响  

EFFECT OF COUPLING AGENT ON ELECTRIC CONDUCTIVITY STABILITY OF COPPER FILLED COMPOSITE PAINTS

作　　者：林硕[1] 吴年强[1] 李志章[2] 

机构地区：[1]浙江大学机械系,杭州310027 [2]浙江大学材料系,杭州310027

出　　处：《复合材料学报》1999年第4期44-49,共6页Acta Materiae Compositae Sinica

摘　　要：采用硅烷偶联剂对铜粉进行处理，使导电涂料的电阻率降低一个数量级，并且经５００ 小时的耐候性实验，电阻率保持稳定。研究了偶联剂对铜粉氧化的抑制作用机理。红外光谱（ＦＴＩＲ）表明，偶联剂可以和铜粉表面以氢键、共价键结合，形成一层保护膜防止铜粉氧化。In the present work, the electric resistance of copper filled composite paint is reduced ten times by addition of coupling agent. And the electric conductivity of the composite paint keeps stable during 500 hours of exposure to air. The mechanism of resisting oxidation is investigated by Flourier Transfer Infrared Spectrometry. It is suggested that the hydrogen bond and the covalence bond between coupling agent and the copper powders are formed. This leads to formation of an oxidation resistant film on the copper powders.

关 键 词：硅烷偶联剂 铜粉 氧化 复合涂料 导电稳定性 

分 类 号：TQ637[化学工程—精细化工]