一种新的PCB无氰化学沉金工艺  

A Cyanide-free Gold Immersion Process and Its Application in PCB

作　　者：董明琪[1] 李德良[1] 徐天野[1] 刘静[1] 董振华 

机构地区：[1]中南林业科技大学,长沙410004 [2]深圳市荣伟业电子有限公司,深圳518116

出　　处：《表面技术》2011年第1期104-106,共3页Surface Technology

基　　金：国家自然科学基金(20976201);湖南省自然科学基金(07JJ6156);国家教委留学人员择优资助项目(2004184)

摘　　要：介绍了一种新的不含游离氰的无氰化学沉金工艺,并从工艺特点、沉金效果、产品品质和环保处理等方面将该无氰沉金工艺与传统的有氰化学沉金工艺进行了对比分析,分析表明:该无氰沉金工艺的金缸溶液寿命更长,沉积均匀性更好,沉积速率可控,有利于控制金厚和降低镀金的材料成本;产品的品质有保障,过程更环保,可望替代传统的有氰工艺。A new cyanide-free immersion gold process was described and a comparative analysis with traditional cyanide immersion gold process in craft characteristic,effect of immersion gold,the quality of produce was taken.The analysis result shows that this cyanide-free immersion gold process can enhance the endurability of the gold solution,improve the edimentary uniformity,help to control gold palting rate,gold plating thickness and reduce the cost of materials.In all cyanide-free immersion gold process can improve the product quality and is more environmental-friendly and is a promising candidate to replace the traditional cyanide process.

关 键 词：无氰沉金 工艺 沉金效果 环保 

分 类 号：TQ153.1[化学工程—电化学工业]