嵌入式共固化复合材料阻尼结构的新进展  

New development of the embedded and co-cured composite damping structres

作　　者：梁森[1] 梁磊[2] 米鹏[1] 

机构地区：[1]青岛理工大学,青岛266033 [2]宝鸡文理学院,宝鸡721007

出　　处：《应用力学学报》2010年第4期767-771,共5页Chinese Journal of Applied Mechanics

基　　金：国家自然科学基金(50875135);国家973重点基础研究发展计划(2008CB617515)

摘　　要：综述了近年来嵌入式共固化复合材料阻尼结构研究的最新进展,主要包括共固化工艺及其对粘弹性材料的要求、嵌入的阻尼材料及其薄膜的结构形式、理论分析研究的方法等。突出强调了结构功能一体化阻尼构件的最新研究成果,提出实际应用还需继续研究解决的问题,为进一步探索轻质大阻尼复合材料构件的设计理论和制作工艺提供参考。The latest development of the embedded and co-cured composite damping structures is reviewed in this paper,mainly including the co-cured processing and its requirements on viscoelastic material,the embedded damping materials and their membrane structure,the theoretical analysis approach and so on.The new fruits of the damping elements of the integrative function-structure are emphasized.Finally,the comments are offered about the most important remaining problems in this area and the further developments are evaluated.This investigation provides an important reference for further exploring design theory and manufacturing technology of the composite material structure with lightweight and high damping.

关 键 词：复合材料 共固化工艺 阻尼薄膜 功能结构一体化 粘弹性材料 

分 类 号：TB332[一般工业技术—材料科学与工程]