基于机器视觉的SMT焊膏印刷缺陷自动三维检测  

SMT solder paste deposition 3D inspection based on machine vision

作　　者：周贤善[1] 罗兵[1] 

机构地区：[1]长江大学计算机科学学院,湖北荆州434023

出　　处：《计算机工程与设计》2010年第24期5363-5366,共4页Computer Engineering and Design

摘　　要：在电子产品印刷电路板表面贴片安装生产中,传统的激光三角法进行焊膏印刷质量三维缺陷检测存在速度慢和精度低的不足,基于光栅投影相位测量轮廓术的机器视觉三维测量方法可以提高速度和精度,结合数字光处理投影仪产生正弦投影光栅,并通过机器视觉采集的二维图像改进性能、提高速度,较好解决了相位展开、阴影区域测量等难点。仿真实验结果表明,该方案速度快、精度高且具有很好的可靠性。The solder paste deposit inspection which is an important in PCB surface mounted technology assembly needs both 2D analysis and 3D volume measurement.Conventional methods as laser triangulation suffered slow speed and low reliability,inspecting by grating projection phase shifting profilometry 3D scale fusion with 2D image features,which help phase measuring and unwrapping as well as shadows processing can improve performance.Experimental results show that the approach is fast,accurate and reliable.

关 键 词：焊膏缺陷检测 相位测量轮廓术 机器视觉 相位展开 阴影问题 

分 类 号：TP274.5[自动化与计算机技术—检测技术与自动化装置]