无氧铜密封件漏气原因的金相显微分析  

Gas leakage causes analysis of oxygen-free copper seal devices by metallographic microscopy

作　　者：丁丽[1] 章安辉[1] 李宝珠[1] 周智惠[1] 刘立娜[1] 

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300192

出　　处：《现代仪器》2010年第6期27-28,共2页Modern Instruments

摘　　要：用于电真空器件密封用的无氧铜在使用中漏气,利用金相显微技术对不同氧含量的无氧铜进行对比分析,发现:无氧铜中氧含量偏高,出现"氢病",造成微裂纹,导致无氧铜在使用过程中出现漏气。Oxygen-free copper was always used to keep electron tube sealing, but gas leakage happened sometimes. Oxygen-free coppers with different oxygen content were comparative analysis by metallographic microscopy. And come to a conclusion： oxygen-free copper with high oxygen content lead to microcrack, then gas leakage will happen. This is called inverse hydrogen embrittlement.

关 键 词：无氧铜 微裂纹 氢病 

分 类 号：TG146.22[一般工业技术—材料科学与工程]