钙铝硼硅/氧化铝系玻璃-陶瓷致密化过程及介电性能  

Densification and dielectric properties of CABS/Al_2O_3 system glass-ceramics

作　　者：方亮[1] 周洪庆[1] 韦鹏飞[1] 朱海奎[1] 刘明[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《功能材料与器件学报》2010年第6期575-579,共5页Journal of Functional Materials and Devices

基　　金：国家"863"项目:2007AA03Z455

摘　　要：通过DSC、XRD、SEM、EDS等测试手段,研究了钙铝硼硅/氧化铝系玻璃-陶瓷一个典型组成的致密化过程,并讨论了在这过程中物相、微观结构以及介电性能的变化规律。研究结果表明:在800～900℃烧成范围内,材料先致密化后析晶;825℃时,材料已烧结致密化,介电常数达到其最大值;850℃时,玻璃中析出钙长石晶体,介电损耗大幅下降;随着温度的进一步提高,材料结构变得松散,介电损耗略有增大。1 MHz下,850℃所烧试样介电常数为7.9,介电损耗小于1×10^(-3),是一种性能优良的LTCC材料。The densification process,phase shift,microstructure and dielectric properties of CABS/ Al_2O_3 system glass -ceramics were studied using DSC,XRD,SEM and EDS.The results show that densification has been achieved at 825℃and dielectric constant（ε_r） gets its maximum.At 850℃Anorthite precipitates from the matrix phase,which leads to the significant decrease of dielectric loss（tanδ）.With heat -treatment temperatures increasing,tanδincreases slightly due to the loose microstructure.The obtained glass - ceramics at 850℃which haveε_r of 7.9 and tanδless than 1×10^（-3）can be used as promising LTCC materials.

关 键 词：玻璃-陶瓷 致密化 析晶 LTCC材料 

分 类 号：TQ171[化学工程—玻璃工业]