0.2μm级硬质合金的制备及其应用性能  

Preparation of 0.2μm grade cemented carbide and its cutting test

作　　者：谢海唯 张守全 吴冲浒 程登峰 

机构地区：[1]国家钨材料工程技术研究中心厦门钨业股份有限公司技术中心,厦门361009 [2]厦门金鹭特种合金有限公司,厦门361006

出　　处：《粉末冶金材料科学与工程》2010年第6期640-643,共4页Materials Science and Engineering of Powder Metallurgy

基　　金：国家科技支撑计划资助项目(2007BAE05B02)

摘　　要：以厦门金鹭特种合金有限公司的超细WC粉、超细Co粉作为原料,分别采用普通压力烧结技术与热等静压(HIP)技术,在国内首次实现了0.2μm级硬质合金G0209的制备。在合适的HIP烧结温度、烧结压力、烧结时间下所生产的0.2μm级硬质合金的抗弯强度和由其制备的印刷电路板(printed circuit board,PCB)微钻抗冲击性能都优于普通压力烧结产品。同时作为参比,将一流硬质合金厂商住友生产的0.2μm级硬质合金棒材制备成PCB微钻,进行性能对比试验测试,结果显示,本研究生产的0.2μm级硬质合金品质达到了住友同系列产品的同等水平。0.2 μm grade cemented carbide G0209 with excellent quality were produced through normal pressure sintering and hot isostatic press（HIP） sintering processes using high quality ultra-fine WC powder and Co powder produced by Xiamen Golden Egret Co.,Ltd.as raw materials.While adapting suitable temperature,pressure and time of HIP sinter,the transverse rupture strength（TRS） and the impact resistance property in the micro-drill of the printed circuit board（PCB） are both better than that of the product of normal pressure sinter.At the same time,the properties of 0.2 μm cemented carbide-G0209 were compared with the 0.2 μm grade carbide produced by Sumitomo Hard Material in the present paper,the test results indicate that the properties of G0209 grade are as good as that of the Sumitomo Hard Material＇s.

关 键 词：0.2μm级硬质合金 HIP烧结 PCB微钻 切削试验 

分 类 号：TF125.3[冶金工程—粉末冶金]