陶瓷／金属复合基板技术  

Research on Ceramic/Metal Compound Substrate Technology

作　　者：李建辉[1] 沐方清[1] 董兆文[1] 

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230022

出　　处：《混合微电子技术》2010年第4期28-31,共4页Hybrid Microelectronics Technology

摘　　要：陶瓷／金属复合基板是一种高导热和高密度布线基板。本工作采用过渡层结构实现了低温共烧陶瓷（LTCC）与金属基片的结合。研究了陶瓷／金属复合基板制作过程中金属基片的选取、过渡层的配制、LTCC生瓷带的选择、复合基板空腔制作等技术。通过研制过渡层材料，选用CuMoCu为金属基片，制作出了性能较好的陶瓷／金属复合基板。LTCC - metal （ Low temperature co - fire ceramic on metal） is a compound substrate with high thermal conduc- tivity and high density layout. The combination of the LTCC substrate and metal plate is realized by the transitional layer material. The technical research for the LTCC - metal includes the selection of metal plate, the development of the transitional layer materi- al,the selection of the LTCC green tape, the sintering of the compound substrate, the fabrication of the cavity and so on. The LTCC - metal compound substrate with preferable performance is made out by the development of the transitional layer material and the selection of CuMoCu metal plate.

关 键 词：低温共烧陶瓷(LTCC) 金属基片 复合基板 过渡层 空腔 

分 类 号：TM286[一般工业技术—材料科学与工程]