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作 者:刘明耀[1] 鲁涛[1] 李克华[1] 闫宁[1] 赵延军[1] 王永宝[1]
出 处:《金刚石与磨料磨具工程》2010年第6期1-7,共7页Diamond & Abrasives Engineering
摘 要:本文介绍了"十一五"期间我国高速高效精密超硬材料磨具制造领域研究开发的汽车发动机曲轴高速高效磨削用cBN砂轮、集成电路(IC)晶圆背面减薄磨削用金刚石系列砂轮、晶圆划片与分割用电镀结合剂高精度超薄金刚石切割砂轮、精密研磨用陶瓷结合剂超硬材料磨盘、高硬度刀片磨边用新型复合结合剂金刚石砂轮等5种新产品。重点描述了在新型结合剂、成型技术、加工技术等方面取得的技术突破以及产品应用效果,并对该领域未来发展趋势做了简要分析。This article introduced five kinds of new products of high speed high efficiency and precision diamond/cBN grinding wheels and discs during the" Eleventh Five-Year Plan" period, including high speedand efficient cBN grinding wheels for automotive engine crankshaft; serial diamond wheels for IC (integrated circuit) wafer back grinding; ultra-thin high-precision electroplated diamond cutting wheels for IC wafer dicingand cutting; vitrified bond cBN/diamond discs for precision grinding; composite bonded diamond grinding wheels for high hardness insert edging, etc. Presentations were made emphatically on the breakthrough of newbond, molding technology, machining technology, as well as the application results of these superabrasive tools and future trends in this area are briefly analyzed.
分 类 号:TG74[金属学及工艺—刀具与模具]
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