碳化硅环形金刚石线锯加工的裂纹研究  

Research on the machining crack of sic sliced by endless diamond wire saw

作　　者：孟剑峰[1] 孟磊[2] 贺东溥[1] 

机构地区：[1]山东大学机械工程学院,济南250061 [2]济南技术学院,济南250031

出　　处：《金刚石与磨料磨具工程》2010年第6期23-28,共6页Diamond & Abrasives Engineering

摘　　要：碳化硅晶体硬度高,属于难加工材料,环形金刚石线锯加工具有切缝窄、加工效率高、加工质量好、能加工硬度高尺寸大的脆性材料的优势。根据锯丝磨粒的分布特点,给出了单颗磨粒锯切力与总锯切力的关系式。建立了锯切表面裂纹深度与锯切力之间、表面粗糙度与锯切力之间的理论关系,此关系可用于碳化硅线锯加工裂纹的预测。最后,给出了减少加工裂纹的措施。The SiC crystal has very high hardness and is considered a difficult-to-machine material. The endless diamond wire saw has the advantages of thin kerf, high slicing speed, good quality, and ability to slice harder and bigger dimension brittle materials. Based on the distribution of diamond grits on the surface of wire saw, the relationship between sawing force on single diamond and the whole wire saw was revealed. And the theoretical formulas between the depth of crack on the sliced SiC surface and sawing force, as well as processed surface roughness and sawing force were found, which can be used to predict the slicing crack of SiC crystal. The effective methods to reduce slieing crack were proposed.

关 键 词：碳化硅晶体 环形线锯 裂纹 

分 类 号：TG74[金属学及工艺—刀具与模具] TQ164[化学工程—高温制品工业]