无规嵌段共缩聚聚酰亚胺的制备与性能研究  

Study on Preparation and Properties of Random and Block Polyimide Copolymer

作　　者：陈磊[1] 梁凤芝[1] 陈昊[1] 范勇[1] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,哈尔滨150040

出　　处：《绝缘材料》2010年第6期1-3,8,共4页Insulating Materials

基　　金：国家自然科学基金项目(503773008);黑龙江省科技攻关项目(GC04A216)

摘　　要：以3,3′,4,4′-联苯四羧酸二酐(BPDA)、对苯二胺(pPDA)、均苯四甲酸二酐(PMDA)、4,4′-二氨基二苯醚(ODA)4种单体为原料,制备出一系列pPDA-BPDA组分占不同摩尔百分含量的无规嵌段共缩聚聚酰亚胺薄膜。通过力学性能、热性能、电性能测试对薄膜的性能进行了研究。结果表明,随着pPDA-BPDA刚性嵌段引入量的增加,聚酰亚胺薄膜的弹性模量和拉伸强度得到较大提高,而其断裂伸长率呈现先增加后下降趋势;热稳定性增强;击穿场强在pPDA-BPDA组分摩尔百分含量为50%时达到最大,但均低于未引入嵌段时的薄膜的击穿场强。A series of random block polyimide copolymer films with different molar content of pPDA-BPDA component were prepared by condensation of diphenylether-3,3′,4,4′-tetracarboxylic dianhydride（BPDA）,p-phenylene diamine（pPDA）,pyromellitic dianhydride（PMDA） and 4,4′-diamino diphenylether（ODA）.The films were studied by test of mechanical properties,thermal properties and electrical performance.The results show that,with increase of pPDA-BPDA rigid block content,the modulus and tensile strength of the polyimide films increase significantly,while the break elongation first increases and then drops;the onset temperature rises,and thermal stability increases;the breakdown strength reaches maximum when the molar content of pPDA-BPDA component is 50%,and is lower than that of the undoped film.

关 键 词：聚酰亚胺 无规嵌段 力学性能 热稳定性 击穿场强 

分 类 号：TM215[一般工业技术—材料科学与工程] TQ323.7[电气工程—电工理论与新技术]