镀镍溶液中铜杂质的分析方法  

Analysis Method of Copper Impurity in Nickel Plating Bath

作　　者：郭崇武[1] 

机构地区：[1]广州超邦化工有限公司,广东广州510460

出　　处：《电镀与精饰》2011年第2期41-43,共3页Plating & Finishing

摘　　要：利用铜试剂与Cu2+生成黄棕色络合物的特效显色反应,用分光光度法测定镀镍溶液中的铜杂质。用EDTA掩蔽镍离子和铁离子,在氨碱性条件下显色,显色液pH≈9.2。以镀液底色作参比,在λ=450 nm处测定。实验表明,测定结果的相对平均偏差为2%,能够满足监控镀镍溶液中铜杂质的要求。The copper impurity in nickel plating bath was determined with spectrophotometry by using the speciality that DDTC reacts with Cu2＋ ion to form yellow-brown complex.This reaction occurred by Ni2＋ and Fe2＋ ions masked with EDTA and under an ammoniac condition of pH≈9.2.The determination was carried out at wavelength 450 nm with nickel plating solution as reference solution.The results show that the relative average deviation of this method is 2%.And this analysis method can satisfy the requirement of copper impurity monitoring and controlling in nickel plating bath.

关 键 词：镀镍溶液 铜杂质 铜试剂 分光光度法 

分 类 号：TG115.335[金属学及工艺—物理冶金]