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作 者:薛丽梅[1] 李双志[1] 刘翀[1] 陈彬[1] 张风华[1]
出 处:《化学与粘合》2011年第1期30-32,共3页Chemistry and Adhesion
基 金:哈尔滨市科技局2009年度科技攻关计划项目"超分散铜粉末"(编号:2009AA4AE050)
摘 要:超细铜粉是指粒径介于10-9~10-5m的微小铜粒子,它具有导电导热性能好、粒径小、耐腐蚀、表面光洁、流动性强等特点,在力学、电学、化学和电极材料的制造等领域有许多特异性能和极大的潜在应用价值。在室温下探讨了电流密度、溶液浓度、超声频率以及时间对超细铜粉粒度分布的影响规律,采用扫描电镜对超细铜粉做了物相分析。结果表明:随着电流密度和超声频率的增大,超细铜粉的粒度变小;超声时间对超细铜粉粒度影响不大;但随着电解溶液浓度的增大,超细铜粉的最终粒度也变大,不利于超细铜粉生成。Superfine copper powder is a kind of micro copper particle whose particle size is between 10^-9-10^-5m, it has excellent electrical and thermal conductivity, small particle size, resistance to rust, clean surface, better fluidity, therefore, it has great value in the application of mechanics, electrology, chemistry and preparation of electrode materials, etc. At room temperature, the effects of current density, solution concentration, ultrasonic frequency and time on the superfine copper powder particle size distribution are discussed, and the phase analysis of superfine copper powder is carried out with using scanning electron microscopy. The results show that with the current density and ultrasonic frequency increase, the superfine copper powder particle size is becoming smaller; the ultrasonic time has little effect on the granularity; but as the solution concentration increases, the final powder particle size have changed, it is not conducive to produce superfine copper powder.
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