微细孔、阵列孔及微细三维型腔的超声加工研究  

Study of Micro Hole,Hole Array and 3D Micro Cavity Machined By USM

作　　者：安成明[1] 殷国强[1] 李剑中[1] 余祖元[1] 

机构地区：[1]大连理工大学机械工程学院,辽宁大连116024

出　　处：《电加工与模具》2011年第1期23-27,共5页Electromachining & Mould

基　　金：国家自然科学基金资助项目(50775020);国家863高技术研究发展计划资助项目(2009AA044205)

摘　　要：利用自行开发的微细电火花与微细超声复合加工装置,对微孔超声加工中效率随孔深的变化、磨料颗粒尺寸对精度的影响等进行了实验研究,并采用恒加工力控制方式,在单晶硅100晶面实际完成了直径18μm圆孔和28μm×28μm方孔的超声加工、微细十字孔与阵列孔的超声反拷加工以及微细三维型腔的工具均匀损耗补偿分层铣削超声加工。To machine micro features in hard and brittle materials,a micro ultrasonic machining（USM） is developed equipped with a wire electrical discharge grinding（WEDG） unit used to prepare micro tools.The relationship between the machining efficiency and the micro hole depth and the influence of abrasive size on the machining accuracy are studied experimentally.In this study of micro USM,the machining process is controlled by constant static load.The circular hole with 18μm in diameter and the square hole with 28×28 μm2 have been drilled in silicon successfully.The micro-hole array and a cross-shaped hole have also been generated by micro-USM,as well as 3D micro cavity by applying Uniform Wear Method.

关 键 词：微细超声加工 微细阵列孔 微细三维型腔 

分 类 号：TG661[金属学及工艺—金属切削加工及机床] TG663