铜渣中金属液滴电毛细迁移现象的显微观察  

Micro-examination of Copper Droplet Electro-capillary Migration in the Copper Smelting Slag

作　　者：李长荣[1,2] 江明丽[1] 

机构地区：[1]贵州大学 [2]贵州省材料结构与强度重点实验室

出　　处：《现代矿业》2011年第2期44-46,共3页Modern Mining

基　　金：贵州省科学技术基金项目(20072186)

摘　　要：铜冶炼炉渣是重要的二次金属资源,对其进行回收利用具有重要意义。对铜冶炼熔渣中金属液滴的电毛细迁移现象进行了渣相的显微观察,研究结果表明:在无电场作用时,金属铜滴在熔渣中的聚集和迁移现象不明显,铜滴杂乱地分布于熔渣的各个区域。在有外加电场作用时,金属铜滴在熔渣中的聚集和迁移程度明显加快,在阴极区的铜液滴数量和尺寸大于阳极区,并集中分布于阴极区某一区域。随着保温时间的增加熔渣中铜滴半径也随之增大,最后形成较为规则的圆形液滴。The slag of copper smelting is a kind of important secondary metal resource.The slag phase investigation about the electro-capillary migration of metal droplet in the copper smelting slag was carried out.The results show that the process of copper droplets migration and accumulation in the slag is not obvious without electric field,and they are randomly distributed in the slag.But that process will be increased in the presence of external electric field.The quantity and size of copper droplet is larger at cathode than at anode,and the copper would be concentrated in a particular area of cathode.The radius of copper droplet in the slag will increase with the time increase of holding temperature,they finally presented round shape.

关 键 词：铜渣 电毛细迁移 铜液滴 显微观察 

分 类 号：X758[环境科学与工程—环境工程]