脉冲电沉积Cu-Co合金镀层及其性能  

Cu-Co alloy plating with pulse electrodeposition and its performance

作　　者：朱福良[1,2] 余细波[1] 黄秀扬[1] 张霞[1] 

机构地区：[1]兰州理工大学材料科学与工程学院,甘肃兰州730050 [2]兰州理工大学有色金属合金及加工教育部重点实验室,甘肃兰州730050

出　　处：《兰州理工大学学报》2011年第1期9-13,共5页Journal of Lanzhou University of Technology

基　　金：甘肃省自然科学基金(3ZS042-B25-029);兰州理工大学科研发展基金(0851)项目的资助

摘　　要：采用铂片做阳极,在不锈钢基体上采用脉冲电沉积法制备Cu-Co合金镀层,通过与直流镀层相比较,对脉冲镀层的耐蚀性、耐高温性、硬度以及组织结构进行研究.结果表明:脉冲镀层的耐蚀性、耐高温性明显优于直流镀层,硬度也较直流镀层高.SEM和XRD分析结果显示,脉冲镀层较直流镀层表面更平整,组织更致密,晶粒尺寸也更小.此外,研究占空比对镀层的影响,发现镀层的Co含量以及硬度随着占空比的增大而增大,当占空比达到0.7时,镀层有最高的Co含量和硬度.Taking a slice of Pt as anode,Cu-Co alloy plating was prepared by using pulse electrodeposition on the matrix of stainless steel.Corrosion resistance,high-temperature resistance,hardness and microstructure of the pulse deposits were investigated by means of comparison to that of DC deposits.The results showed that pulse plating was superior to DC plating not only in corrosion resistance and high-temperature resistance,but also in hardness.Scanning electron microscopy and X-ray diffraction were used to analyzed the surface morphology and structure of the plating,and the results indicated that as compared to DC plating,the surface of pulse plating was smoother,and the structure,more compact with smaller grain size.In addition,the effect of duty cycle on the deposits was explored to find that Co content and hardness of the deposits were increased with the increasing in duty cycle,and went up to its peak when duty cycle increased to 0.7.

关 键 词：脉冲电沉积 CU-CO合金 耐蚀性 占空比 

分 类 号：TG146.1[一般工业技术—材料科学与工程]