C-mount封装不同激光器芯片尺寸的热阻分析  

Thermal-resistor Analysis of The Laser Chips with Different Size in C-mount Package

作　　者：马祥柱[1] 霍晋 曲轶[1] 杜石磊[1] 王宇[1] 

机构地区：[1]长春理工大学高功率半导体激光国家重点实验室,吉林长春130022 [2]海特光电有限责任公司,北京100083

出　　处：《发光学报》2011年第2期184-187,共4页Chinese Journal of Luminescence

基　　金：国家自然科学基金(60976044)资助项目

摘　　要：采用波长漂移法对基于C-mount封装类型的不同尺寸芯片的热阻进行测量,得到了使热阻最小的最佳芯片尺寸和铟焊料厚度。测量结果表明,在铟焊料厚度为10μm、输出功率为2 W、条宽为200μm、腔长为2 000μm时,激光器芯片的热阻最小值为2.01℃/W。在铟焊料厚度为5μm和10μm两种条件下,对腔长为2 000μm的不同条宽的激光器芯片的热阻进行了测量,在铟焊料厚度为5μm时,激光器芯片的热阻由原来的2.01℃/W降到了1.85℃/W。Thermal-resistor of different chips based on C-mount package have been measured with the method of wavelength shift in this paper. Through the thermal-resistance measurement, we can get the best size of chip and the thickness of In solder to make the smallest thermal-resistance. The results show that when the thickness of In solder is 10μm, the output power is 2 W, the bar width is 200 μm, the cavity length is 2 000μm and the minimum thermal-resistor of the chip is 2.01 ℃/W. The thermal-resistors with carvity length of 2 000 μs have been measured when the In solder thickness is 5 μm and 10 μm. The results show that the thermalresistor dropes from 2.01 ℃/W to 1.85 ℃/W for the 5 μm In solider.

关 键 词：热阻 C-mount封装 激光二极管 铟焊料 

分 类 号：TN248.4[电子电信—物理电子学]