硫酸盐电沉积Cu-Co合金工艺  

Process for Electrodeposition of Copper-Cobalt Alloy Coating in Sulfate Bath

作　　者：余细波[1] 朱福良[1,2] 张霞[1] 黄秀扬[1] 

机构地区：[1]兰州理工大学材料科学与工程学院,甘肃兰州730050 [2]兰州理工大学有色金属合金及加工教育部重点实验室,甘肃兰州730050

出　　处：《材料保护》2011年第3期32-35,89,共4页Materials Protection

基　　金：甘肃省自然科学基金(3ZS042-B25-029);兰州理工大学科研发展基金(0851)资助项目

摘　　要：采用电沉积方法在硫酸盐体系中制备了Cu-Co合金。用扫描电镜、EDX能谱仪和XRD分析舍金镀层的表面形貌、组成和结构，考察了主盐离子浓度、配位剂浓度、pH值以及温度等工艺参数对Cu-Co合金组成的影响。同时为了使沉积过程中产生的气泡及时脱离镀层，防止镀层出现针孔，添加了表面活性剂十二烷基硫酸钠。结果表明：镀层中的Co含量随镀液中Co^2＋浓度的升高而增大；在酸性条件下，Co的含量随pH值的升高而增大；温度升高，镀层中的Co含量减小，镀层晶粒也更粗大。在不超过60g/L时，配位剂柠檬酸钠的浓度增加对Co的沉积具有促进作用。此外，试验中添加微量的十二烷基硫酸钠以及采用较低的温度获得了光亮均匀的镀层，且pH值控制在5～6之间的Cu-Co合金镀层结合力较好。Cu-Co alloy coating was prepared in sulfate solution by electrodeposition.The morphology,composition and structure of the coating were analyzed by means of scanning electron microscopy,energy dispersive spectrometry and X-ray diffraction.The effects of process parameters such as concentration of major salt,concentration of complexing agent,pH value and temperature on the composition of the coating were investigated.Surfactant sodium lauryl sulfate was added to prevent formation of pinholes in the coating.Results show that Co content in the coating increases with increasing Co2+ concentration.Under acidic condition,the Co content in the coating increased with increasing pH value,and decreased with increasing temperature,accompanied by increase of grain size.Below 60 g/L,the increase of the concentration of complexing agent sodium citrate contributed to the promotion of Co deposition.It was feasible to obtain smooth and bright coating by introducing a trace amount of sodium lauryl sulfate and adjusting the temperature at a low value.The coating obtained at pH value of 5~6 had good adhesion to substrate.

关 键 词：Cu—Co合金电沉积 硫酸盐体系 镀层元素含量 性能 

分 类 号：TQ153.2[化学工程—电化学工业]