以硼氢化钠为还原剂化学镀镍的电化学研究  

Electrochemical Study on Electroless Nickel Plating Using Sodium Borohydride as the Reductant

作　　者：贾飞[1] 王周成[1] 

机构地区：[1]厦门大学化学化工学院,化学工程与生物工程系,福建厦门361005

出　　处：《物理化学学报》2011年第3期633-640,共8页Acta Physico-Chimica Sinica

基　　金：国家自然科学基金(20573086)资助项目~~

摘　　要：采用线性电位扫描伏安法研究了以硼氢化钠为还原剂的化学镀镍体系,考查了镀液组成及工艺条件对化学镀镍硼阴、阳极过程的影响,结果表明:乙酸镍和硼氢化钠含量的提高分别促进了Ni2+的还原反应和BH-4的氧化反应;乙二胺、氢氧化钠以及添加剂硫脲、糖精钠对阴、阳极反应均有不同程度的抑制作用,同时添加剂中的硫元素加速了镍的氧化;升高温度有利于阴、阳极反应的进行.We studied electroless Ni-B plating with sodium borohydride as the reductant by linear sweep voltammetry.The effects of bath solution composition and operating conditions on the cathodic reduction and anodic oxidation were studied.Increases in the concentrations of nickel acetate and sodium borohydride accelerated the reduction of Ni2＋ and the oxidation of BH4,respectively.Ethylenediamine,sodium hydroxide,thiourea and saccharin sodium inhibited both the cathodic and anodic reactions to varying degrees.Additionally,sulfur in the additives promoted the dissolution of nickel.High temperature was beneficial to both the cathodic reduction and anodic oxidation.

关 键 词：化学镀镍 阴极还原 阳极氧化 极化 添加剂 吸附 

分 类 号：TQ153.12[化学工程—电化学工业]