聚酰亚胺-环氧树脂胶黏剂的固化动力学研究  

Study on the Cure Reaction Kinetics of Polyimide-epoxy Resin Adhesive

作　　者：许梅芳[1] 毛蒋莉[1] 虞鑫海[1] 刘万章 

机构地区：[1]东华大学应用化学系,上海201620 [2]浙江金鹏化工股份有限公司,浙江台州318050

出　　处：《化学与粘合》2011年第2期17-20,共4页Chemistry and Adhesion

摘　　要：以2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPOPP)和2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BPADA)为原料在室温下于DMAc溶剂中合成了一种新型聚酰亚胺,并用其改性环氧树脂体系获得聚酰亚胺-环氧体系胶黏剂。利用差示扫描量热计(DSC),以不同的升温速率对聚酰亚胺-环氧树脂胶黏剂进行DSC扫描;并对聚酰亚胺-环氧树脂胶黏剂的固化反应动力学进行研究,采用Kissinger法计算出该聚酰亚胺-环氧树脂体系胶黏剂的活化能为76.64kJ/mol;结合Crane公式求出该体系的反应级数为0.9;并确定了频率因子A、峰温时的反应速率常数Kp。结合不同升温速率的DSC谱图,以外推法确定了聚酰亚胺-环氧树脂胶黏剂固化工艺为130℃/1h→160℃/2h→180℃/3h。The new type of polyimide powder was synthesized through the reactions of polycondensation of 2,2-bis [4-（4-aminophenoxy）phenyl] propane （BAPOPP） and 2,2-bis[4-（3,4-dicarboxyphenoxy）phenyl]propane dianhydride （BPADA） in DMAe solvent at room temperature and imidization by azeotropy. The novel polyimide-epoxy adhesive was also prepared by modification of epoxy resin with this polyimide. The DSC curves of the above-mentioned polyimide-epoxy adhesive were obtained with different heating rates. Moreover, the curing kinetics were also studied by using Kissinger equation and Crane formula, the activation energy of 76.64kJ/mol was acquired, reaction order was 0.9, the frequency factor A and the reaction rate constant Kp at the peak temperature of the reaction was also obtained. The polyimide-epoxy adhesive euring process was determined as 130℃/1h-160℃,2h-180℃/3h by extrapolation of DSC curves.

关 键 词：聚酰亚胺 环氧树脂 胶黏剂 固化反应 动力学 差热分析 

分 类 号：TQ443.437[化学工程—化学肥料工业]