Ti-Cu固相相界面的扩散研究  

Study on Solid-phase Diffusion of Ti-Cu Interface

作　　者：吕玉荣[1] 付保英[2] 杨泽亮 

机构地区：[1]鹤壁职业技术学院材料工程系,河南鹤壁458030 [2]鹤壁职业技术学院机电工程学院,河南鹤壁458030 [3]中国石油天然气管道局天津设计院,天津大港300280

出　　处：《热加工工艺》2011年第4期37-38,共2页Hot Working Technology

摘　　要：采用"铆钉法"制备了Ti-Cu扩散偶,即将预处理后的铜丝嵌入到块状钛基体中,制备包含"准相界面"的样品。观察在600～700℃真空烧结不同时间时的钛铜界面的扩散情况,研究了烧结温度和保温时间对扩散层厚度的影响。结果表明,扩散层的厚度随烧结温度的提高和保温时间的延长而增厚。Ti-Cu diffusion couple was prepared by mechanical method.A nickel wire was riveted into the titanium matrix.The prepared specimens were sintered in the vacuum annealing furnace at 600 ℃～700 ℃ for 50 h～200 h.The diffusion layer was measured with optical microscope（OM）.The thickness of the diffusion layer was affected by both the temperature and holding time.The results show that the thickness of the diffusion layer increases obviously with the increase of temperature and holding time.

关 键 词：Ti-Cu扩散偶 相界面 扩散层 

分 类 号：TG146.23[一般工业技术—材料科学与工程]