高温超导带材Bi-2223/Ag的焊接接头电阻研究  

Study on the welded splice between Bi-2223/Ag tapes

作　　者：邵慧[1,2] 严仲明[1] 付磊[1,2] 李海涛[1] 王豫[1,2] 

机构地区：[1]西南交通大学电气工程学院,成都610031 [2]西南交通大学磁浮技术与磁浮列车教育部重点实验室,成都610031

出　　处：《低温与超导》2011年第3期30-33,共4页Cryogenics and Superconductivity

摘　　要：针对高温超导带材Bi-2223／Ag的焊接问题进行了研究。利用ANSYS建立焊接接头电阻特性的有限元计算模型，仿真和计算分析了焊料材料、搭接长度和焊锡层厚度对接头电阻值的影响，并进行了实验验证。实验表明：可通过减少焊料厚度，增加焊接搭接长度来减少接头电阻，当焊接长度在2—5cm，焊料厚度为0．5mm时，Bi-2223／Ag带材间的接头电阻在液氮温度下可以控制在10^-7～10^-8Ω之间，可以满足超导装置稳定运行的要求。This paper made systematical studies on the joint of Bi -2223/Ag HTS tape. The FEM simulation model of joint resistance property was established by ANSYS. It was used to simulate, analyse the effect of solder material, contact lenth and solder layer thickness on joint resistance. Experiment results showed that joint resistance could be reduced by decreasing the solder thickness and increasing the contact length. When the contact length was 2-5cm and the solder thickness was 0.5mm, the joint resistance of Bi -2223/Ag HTS tapes at liquid nitrogen temperature could be controlled within the range of 10-7- 10^-8Ω）, which could meet the requires of stable operation of superconducting devices.

关 键 词：接头电阻 焊接工艺 BI-2223/AG带材 

分 类 号：TM262[一般工业技术—材料科学与工程]