酸性化学镀镍工艺条件优化研究  

Research on technical conditions optimization of acid electroless nickel plating

作　　者：尚小清[1] 

机构地区：[1]西北大学城市与环境学院,陕西西安710069

出　　处：《应用化工》2011年第2期283-286,共4页Applied Chemical Industry

摘　　要：以硫酸镍为主盐,次亚磷酸钠为还原剂,采用复合络合剂在酸性条件下对45钢镀件进行化学镀镍,在硫酸镍浓度、次亚磷酸钠浓度、醋酸钠浓度、络合剂A浓度、镀液pH值和镀液温度等单因素实验的基础上,以镀层沉积速率为指标,用正交设计法对酸性化学镀镍工艺进行了系统优化,结果表明,最佳施镀条件为:硫酸镍浓度35 g/L,次亚磷酸钠浓度30 g/L,络合剂A浓度10 g/L,镀液pH值6.0。在此条件下镀件的镀层沉积速率高达17.38μm/h,且其质量符合国家相关标准。The electroless nickel plating for 45 steel articles with main salt NiSO4·6H2O,reducer NaH2PO2·H2O and compound complex agent in acid condition was researched.On the basis of single-factor experimental study of NiSO4·6H2O concentration,NaH2PO2·H2O concentration,NaAc concentration,complex agent A concentration,pH value and temperature of plating solution,etc,deposition rate as index,the various influencing factors were optimized systemically in virtue of orthogonal design methodology in electroless nickel plating process.The optimization results demonstrated that deposition rate would reach 17.38 μm/h on condition of 35 g/L NiSO4·6H2O concentration,30 g/L NaH2PO2·H2O concentration,10 g/L complex agent A concentration and pH value 6.0 in plating solution.The products prepared under optimal conditions could be satisfied with national standards.

关 键 词：化学镀镍 正交设计 镀层沉积速率 

分 类 号：TQ153.12[化学工程—电化学工业]