酸性镀铜溶液中硫酸铜和锌杂质的分析方法  

Analysis Methods of Copper Sulfate and Zinc Impurity in an Acid Copper Sulfate Plating Bath

作　　者：郭崇武[1] 

机构地区：[1]广州超邦化工有限公司,广东广州510460

出　　处：《涂装与电镀》2011年第1期40-41,共2页Painting and Electroplating

摘　　要：酸性镀铜溶液中的锌杂质严重影响硫酸铜的测定结果。介绍了硫酸铜和锌杂质的分析方法。用三乙醇胺光度法测定硫酸铜,用EDTA容量法测定硫酸铜和锌杂质的总量,从总量中减去硫酸铜的量得到锌杂质的质量浓度。方法简单,快速而准确,能够满足监控酸性镀铜溶液的要求。The test result of copper sulfate in an acid sulfate copper plating bath was badly affected by zinc impurities when the copper sulfate was analyzed with EDTA volumetry, therefore new analysis methods of the copper sulfate and zinc were established. The copper sulfate concentration is determined by using triethanolamine spectrometric method. Total quantities of the copper sulfate and zinc are determined with EDTA volumetry, and from the total quantities minus the quantity of the copper sulfate, we obtain the zinc concentration. The methods are rapid and exact, which can satisfy requirement to control the acid copper plating solution.

关 键 词：酸性硫酸盐镀铜溶液 硫酸铜 锌杂质 三乙醇胺光度法 EDTA容量法 

分 类 号：TQ153.14[化学工程—电化学工业]