时效温度下钎料的稀土相CeSn_3表面Sn晶须生长  

Tin whisker growth on the surface of CeSn_3 phases of solder at aging temperature

作　　者：田君[1] 李东南[1] 李巍 郝虎[2] 

机构地区：[1]福建工程学院材料科学与工程系,福建福州350108 [2]北京工业大学机电学院,北京100124

出　　处：《电子元件与材料》2011年第4期53-55,共3页Electronic Components And Materials

基　　金：福建省教育厅资助项目(No.JB08191);福建工程学院院基金资助项目(No.GY-Z0744)

摘　　要：于Sn3.8Ag0.7Cu钎料中添加过量的稀土Ce会在其内部形成大尺寸的稀土相CeSn3,将稀土相CeSn3暴露于空气中,研究在时效处理过程中时效温度对其表面Sn晶须生长的影响规律。结果表明:时效温度对稀土相CeSn3表面Sn晶须的生长产生显著影响。室温时效20 min后,其表面会形成少量的白色Sn颗粒;75℃时效20 min后在其表面会出现一些杆状及扭结状的Sn晶须;然而,当高于100℃时,时效20 min后在其表面不会出现Sn晶须,周围的钎料基体发生了明显的隆起现象。Large sized CeSn3 phases were formed in the matrix of Sn3.8Ag0.7Cu solder alloy when adding excessive Ce in it.The effects of aging temperature on tin whisker growth on the surface of CeSn3 phases were investigated during the aging.The results indicate that the aging temperature plays an important role in whisker growing on the surface of CeSn3 phases.During room temperature,a few bright tin particles are formed on the CeSn3 surface after 20 min;during 75 ℃,some rod-like and kinked tin whiskers are formed on the surface of CeSn3 phase after 20 min;however,no whiskers are found and many large hillocks are extruded from the adjacent solder matrix surrounding CeSn3 phases when temperature exceeds 100 ℃.

关 键 词：Sn3.8Ag0.7CuCe钎料 稀土相 SN晶须 时效温度 

分 类 号：TN601[电子电信—电路与系统]