导热高分子复合材料研究进展  

Research Development of Thermally Conductive Polymer Composites

作　　者：孔娇月[1] 陈立新[1] 蔡聿锋[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《中国塑料》2011年第3期7-12,共6页China Plastics

基　　金：西北工业大学研究生创业种子基金资助项目(Z2010077)

摘　　要：在介绍金属材料、无机非金属材料以及高分子材料导热机理的基础上,介绍了导热填料填充高分子复合材料的导热网链机理和热弹性组合机理2种导热机理,该理论可以解释导热高分子复合材料导热过程中不同的现象和规律;归纳了适用于粒子、纤维等填充的聚合物基复合材料的各种导热模型;讨论了树脂基体、导热填料和温度对于高分子复合材料热导率的影响。Based on the general thermal conducting principle of metal, inorganic nonmetallic materials, and polymer materials, two kinds of thermal conducting mechanisms of polymer/heat conductive filler composites were introduced, i. e. , thermal nets chain mechanism and thermal- elastic combination mechanism. These mechanisms could explain various phenomena of heat conduction in polymer composites. Some thermal conduction models suitable for fiber and grain filled polymeric composites were presented. Effect of resin, heat conductive filler, and temperature on the thermal conductivity of polymer composites was discussed.

关 键 词：导热高分子 复合材料 导热机理 导热模型 影响因素 

分 类 号：TB324[一般工业技术—材料科学与工程]