高精密圆度仪的研究与设计  

Design and application of High Precision Roundness Tester

作　　者：冯欢欢[1] 吴旭光[1] 肖鼎新[1] 吴祥[1] 

机构地区：[1]西北工业大学航海学院,陕西西安710072

出　　处：《计算机测量与控制》2011年第3期725-727,共3页Computer Measurement &Control

摘　　要：研究了高精密圆度仪电气部分与测量软件部分,利用线性差动变压器式位移传感器与AD698驱动芯片作为信号前端,精确地将待测工件表面的机械位移量转换成单极性或双极性的直流电压;应用MSP430单片机和18位AD7691数模转换芯片采集电压信号传入上位机,最终用相应的软件进行数据分析;应用结果表明,标准件的圆度值重复精度达到了30nm以下,标准玻璃球的圆度误差达到了0.05μm左右;该系统运行稳定可靠,精确度高,并且降低了系统的功耗,具有一定的实用性和推广价值。The electric components and measurement software of high--precision roundness tester use a linear differential transformer displacement sensors and AD698 driver chip as the signal front--end and precisely make the tested surface mechanical displacement into a uni- polar or bipolar DC voltage. MSP430 MCU and 18--bit AD7691 DAC chip collect the incoming voltage signal and Transfer data to the ulti- mate software for data analysis. The application results show that the repeated roundness accuracy of standard parts reached 30nm and the standard error of the glass ball reached around 0. 05tzm . the system is stable and reliable, high accuracy, and reduces system power consumption, has been certainly practical and worthy.

关 键 词：圆度仪 MSP430F149 AD7691 AD698 LVDT 

分 类 号：TP302[自动化与计算机技术—计算机系统结构]