复合量程微加速度计封装热应力的研究  

Study on Package Thermal Stress of Multi-ranged Micro-accelerometer

作　　者：向婷[1] 郭涛[1] 林大为[1] 刘鹏飞[1] 

机构地区：[1]中北大学电子测试技术国家重点实验室,山西太原030051

出　　处：《仪表技术与传感器》2011年第2期9-11,15,共4页Instrument Technique and Sensor

基　　金：国家自然科学基金(60866039)

摘　　要：贴片胶的选择和贴片工艺对MEMS封装器件的可靠性和有效性影响很大。针对贴片胶固化时热效应的影响,分析复合量程微加速度计封装热应力产生的机理。从贴片胶的材料特性出发,分析贴片胶的厚度、杨式模量及热膨胀系数对硅芯片所受到封装热应力的影响。并通过有限元仿真分析,确定了适合复合量程加速度计封装的贴片胶材料及使用厚度,并用拉曼光谱仪对封装后的应力进行了测试,结果显示应力较小,封装效果良好。Surface mount adhesive selection and its process have great influence on the reliability and effectiveness for MEMS packaging process.Contrary to the thermal effect of surface mount adhesive,this paper described package thermal stress generating mechanism of multi-ranged accelerometer.From its material characteristics,the paper analyzed the package thermal stress of the thickness,Young-type modulus and thermal expansion coefficient for silicon chips.It determined the appropriate range accelerometer packaged composite plastic material and the thickness of patch by finite element simulation,and also tested the package stress with Raman spectroscopy.The result shows that the package stress is smaller and good packaged.

关 键 词：复合量程微加速度计 贴片胶 封装热应力 ANSYS仿真 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]