化学镀Ni-Cu-P工艺及性能研究  

A Study of Electroless Ni-Cu-P Process and Properties

作　　者：张云霞[1] 

机构地区：[1]辽宁石油化工大学继续教育学院,辽宁抚顺113001

出　　处：《电镀与环保》2011年第2期18-19,共2页Electroplating & Pollution Control

摘　　要：三元合金可以进一步提高Ni-P镀层的性能。在化学镀Ni-P基础镀液中加入CuSO4,考察了CuSO4对镀层沉积速率、表面相貌、显微硬度以及耐蚀性能的影响。结果表明:CuSO4提高了Ni-P镀层的沉积速率,减少了镀层表面的缺陷,改善了镀层的致密性和光亮度,提高了镀层的耐蚀性。Ternary alloys can further improve the properties of Ni-P coating.CuSO_4 was added to basic electroless Ni-P plating bath,and the effects of CuSO_4 on the deposition rate,morphology,micro-hardness and corrosion resistance of the coating were investigated.The results show that CuSO_4 can raise the deposition rate,reduce surface defects and improve compactness and brightness of Ni-P coating,thus the corrosion resistance of the coating is improved.

关 键 词：化学镀 硫酸铜 耐蚀性 

分 类 号：TQ153[化学工程—电化学工业]