脆性材料平面磨削温度场的测量及分析  

Measurement and analysis of temperature field in surface grinding of brittle material

作　　者：尤芳怡[1] 沈剑云[1] 徐西鹏[1] 

机构地区：[1]华侨大学机电及自动化学院,厦门361021

出　　处：《金刚石与磨料磨具工程》2011年第1期62-65,共4页Diamond & Abrasives Engineering

基　　金：福建省自然科学基金(E0810021);华侨大学博士启动基金(07BS402)资助

摘　　要：磨削温度直接影响砂轮寿命、加工成本和工件质量,一直是磨削加工领域研究加工过程及其本质的重点。获得磨削弧区温度及工件实际的温度场分布是研究磨削热机理的基础。本文采用NEC TH31-110红外热像仪,测量了平面干磨削脆性材料时的热像图,获得了工件整体温度场分布及沿层深的温度分布数据,确定了工件磨削接触区的最高温度及其准确位置。实验结果表明:工件受磨削温度影响较大的区域主要集中在表层0.5 mm深度,实验结果与理论计算值有较好的相关性。Grinding temperature affects wheel life, processing cost and workpieee quality. How to measure and control grinding temperature is a key problem in studying grinding mechanism. The temperature field in the workpieee was measured using a NEC TH31 - 110 infrared imaging system during surface grinding of brittle material. The highest temperature in grinding zone and its location were obtained from the measured image. The test showed that the most influenced zone of workpiece by the grinding heat was within 0.5 mm depth under the exterior surface. The grinding temperature-rise occurred in exterior surface within 0.5 mm depth. Experimental data con＇elated well with the theoretical result.

关 键 词：脆性材料 平面磨削 温度场 测量 

分 类 号：TG58[金属学及工艺—金属切削加工及机床]