铝和氮化铝陶瓷结合强度与机理研究  

Bonding Strength and Mechanism Between Aluminum and AlN

作　　者：彭榕[1] 周和平[2] 宁晓山[2] 徐伟[2] 

机构地区：[1]北京航空航天大学能源与动力工程学院,航空发动机气动热力国防重点实验室,北京100191 [2]清华大学材料科学与工程系,新型陶瓷与精细工艺国家重点实验室,北京100084

出　　处：《无机材料学报》2011年第3期249-253,共5页Journal of Inorganic Materials

摘　　要：在氮气气氛下、保温10min、948～1098K利用活性金属铸接方法制备铝/氮化铝陶瓷基板,用力学试验机、扫描电子显微镜、高温金相光学显微镜和原子力显微镜对铝/氮化铝陶瓷的结合强度和机理进行研究.结合温度低于973K时,铝和氮化铝陶瓷之间的剥离强度随结合温度升高线性增大,当结合温度超过973K时,结合温度对强度影响很小,铝和氮化铝陶瓷之间的结合强度约为49N/mm,铝和氮化铝陶瓷之间的结合为物理湿润和化学反应湿润共同作用.Al/AlN substrate was produced by die casting bonding process with the bonding time of 10 min in the range of 948K to 1098K under N2 atmosphere.The bonding mechanism and strength were investigated by mechanic testing equipment,high-temperature metallographic microscope,AFM and SEM.When the bonding temperature is increased below 973K,the peeling strength of the aluminium with the AlN ceramic substrate rises linearly.While the bonding temperature is above 973K,the temperature influence on the bonding strength is not significant.The peeling strength of the pure aluminium with the AlN ceramic substrate is about 49N/mm.The bonding mechanism between aluminium and aluminium nitride can be ascribed to physical and chemical reaction wetting.

关 键 词：铝/氮化铝陶瓷基板 结合强度 结合机理 

分 类 号：TQ174[化学工程—陶瓷工业]