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作 者:刘乃亮[1] 齐暑华[1] 理莎莎[1] 吴利敏[1] 鲁惠玲[1]
机构地区:[1]西北工业大学理学院应用化学系,陕西西安710129
出 处:《中国胶粘剂》2011年第3期16-20,共5页China Adhesives
摘 要:采用溶液聚合法合成了高固含量(>80%)聚醚醚酮(PEEK)改性酚醛树脂(PF),用非等温DSC(差示扫描量热)法和T-β(温度-升温速率)外推法对其固化反应动力学过程进行了研究,并根据Kissinger方程、Ozawa方程和Crane方程等计算出该固化反应的动力学参数。结果表明:改性树脂的凝胶化温度为136.68℃,固化温度为167.16℃,后处理温度为197.39℃;其固化体系的表观活化能为100.02 kJ/mol,频率因子为1.84×106 s-1,反应级数为0.94(近似于1级反应)。A high solid content (〉80%) phenolic resin (PF) modified by polyetheretherketone (PEEK) was synthesized by solution polymerization,and its curing kinetics process was investigated by non-isothermal differential scanning ealorimetry(DSC) and T-β(temperature-heating speed) extrapolation. The curing kinetics parameters of PF modified by PEEK were calculated by Kissinger equalion,Ozawa equation and Crane equation. The results showed that the gelling temperature ,curing temperature and post-processing temperature of the modified resin were 136.68 ℃, 167.16 ℃and 197.39 ℃,respectively. The apparent activation energy(Ea),frequency factor(A ) and reaction order(n) of the curing system were 100.02 kJ/mol, 1.84×10^6s^-1 and 0.94(approximately first order reaction), respectively.
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