合金元素对Sn—Zn系无铅钎料性能的影响  

Influence of alloying elements on properties of Sn-Zn lead-free solder

作　　者：李志杰[1] 朱颖[1] 康慧[1] 曲平[1] 卢显昌 刘占忠 

机构地区：[1]北京航空航天大学机械工程及自动化学院,100083 [2]三胜家电制造有限公司,佛山市528300

出　　处：《焊接》2011年第2期41-44,72,共4页Welding & Joining

摘　　要：为了改善Sn-Zn系无铅钎料的综合性能,通过合金化的方法,运用正交试验法,研究了Bi、Ag、A1元素对Sn-9Zn系无铅钎料的润湿性能、抗剪强度以及熔点的影响。结果表明,钎料的润湿性随着Bi元素含量的增加而得到改善,钎料的剪切强度随着Ag元素含量的增多,先提高后降低,综合分析Sn-9Zn-4Bi-0.5Ag-0.05Al钎料的性能最佳,且差热分析表明,该钎料熔点最低,为196.97℃。同时,利用扫描电镜及能谱分析了合金元素对钎料接头显微组织的影响。To improve the comprehensive properties of Sn-Zn Lead-free solder,the influence of Bi,Ag,and Al on the wettability,shear strength and melting point of Sn-9Zn solder were studied by orthogonal test.The results show that the wettability of the solder can be improved by the increase of Bi content,and the shear strength of the solder increases first and then decreases with the content of Ag being increased.The performance of Sn-9Zn-4Bi-0.5Ag-0.05Al is the best,which has the lowest melting point of 196.97 °C measured by the differential thermal analysis. Meanwhile,the microstructure of the joints with Sn-Zn-Bi-Ag-Al solder was analyzed by SEM and EDS.

关 键 词：Sn—Zn系无铅钎料 正交试验 合金元素 

分 类 号：TG454[金属学及工艺—焊接]