A strain-isolation design for stretchable electronics  

作　　者：Jian Wu Ming Li Wei-Qiu Chen Dae-Hyeong Kim Yun-Soung Kim Yong-Gang Huang Keh-Chih Hwang Zhan Kang John A.Rogers 

机构地区：[1]Departments of Civil and Environmental Engineering, and Mechanical Engineering,Northwestern University, Evanston,IL 60208,USA [2]Department of Engineering Mechanics, Dalian University of Technology,Dalian 116024,China [3]Department of Engineering Mechanics,Zhejiang University, Hangzhou 310058,China [4]Materials Research Laboratory,Department of Materials Science and Engineering,Beckman Institute.University of Illinois, Urbana,IL 61801,USA [5]AML,Department of Engineering Mechanics, Tsinghua University,Beijing 100084,China [6]Departments of Chemistry,Electrical and Computer Engineering, and Mechanical Science and Engineering,University of Illinois, Urbana,IL 61801,USA

出　　处：《Acta Mechanica Sinica》2010年第6期881-888,共8页力学学报（英文版）

基　　金：supported by NSF(DMI-0328162 and ECCS-0824129);the National Natural Science Foundation of China (10820101048);Ministry of Education of China,and the National Basic Research Program of China(2007CB936803).

摘　　要：Stretchable electronics represents a direction of recent development in next-generation semiconductor devices.Such systems have the potential to offer the performance of conventional wafer-based technologies,but they can be stretched like a rubber band,twisted like a rope, bent over a pencil,and folded like a piece of paper.Isolating the active devices from strains associated with such deformations is an important aspect of design.One strategy involves the shielding of the electronics from deformation of the substrate through insertion of a compliant adhesive layer. This paper establishes a simple,analytical model and validates the results by the finite element method.The results show that a relatively thick,compliant adhesive is effective to reduce the strain in the electronics,as is a relatively short film.Stretchable electronics represents a direction of recent development in next-generation semiconductor devices.Such systems have the potential to offer the performance of conventional wafer-based technologies,but they can be stretched like a rubber band,twisted like a rope, bent over a pencil,and folded like a piece of paper.Isolating the active devices from strains associated with such deformations is an important aspect of design.One strategy involves the shielding of the electronics from deformation of the substrate through insertion of a compliant adhesive layer. This paper establishes a simple,analytical model and validates the results by the finite element method.The results show that a relatively thick,compliant adhesive is effective to reduce the strain in the electronics,as is a relatively short film.

关 键 词：Strain isolation Thin film SUBSTRATE ADHESIVE Stretchable electronics 

分 类 号：TN818.06[电子电信—信息与通信工程] V271.41[航空宇航科学与技术—飞行器设计]