固结磨料抛光去除均匀性的仿真与实验研究  

Simulation and Experimental Research on Removal Rate Uniformity During Fixed Abrasive Polishing

作　　者：康静[1] 左敦稳[1] 孙玉利[1] 朱永伟[1] 

机构地区：[1]南京航空航天大学,南京210016

出　　处：《中国机械工程》2011年第7期803-807,共5页China Mechanical Engineering

基　　金：中国博士后科学基金资助项目(200904501095);江苏省博士后科研资助计划项目(0901035C)

摘　　要：为分析材料去除的均匀性,利用ANSYS建立了固结磨料抛光过程中的三维应力场模型,得到了该抛光系统加载方式下工件表面的等效应力分布,并分析了各因素对去除均匀性的影响。针对现有加载方式下应力分布不均匀的现象,提出了两项加载方式的改进措施:加厚承载器和重新设计加载装置,并对加载装置的尺寸进行了优化。最后通过两组对比实验,证实了所提出的两项加载方式改进措施的有效性。In order to study removal rate uniformity,a three-dimensional stress distribution model was built using ANSYS herein.The equivalent stress distribution on the workpiece surface was got,and the influence of various factors on the removal rate uniformity was studied.To solve the uneven stress distribution,two methods were proposed： thickening the carrying device and designing a new kind of load device.By doing two groups of comparative experiments,the two methods that proposed to improve stress distribution uniformity were verified to be useful.

关 键 词：固结磨料抛光 等效应力 应力分布均匀性 ANSYS 

分 类 号：TG580[金属学及工艺—金属切削加工及机床]