用激光散斑法获取机床刀具应力场  

Stress measurement of dynamic tool using speckle photography

作　　者：陈基勇[1] 

机构地区：[1]山东工业大学材料学院,山东济南250061

出　　处：《山东科学》1999年第3期47-50,共4页Shandong Science

摘　　要：本文应用激光散斑照相技术，测量了机床刀具的动态切削过程，并采用逐点分析和全场分析方法，分析了所拍摄的散斑图，得到了不同车速和不同切削用量条件下的应力场，并对测量结果进行了讨论。Speckle photography is introduced in this paper.The dynamic tooling process of the planer tool is measured by means of speckle photography.The stress fileld in different cutting velocity and in different cutting output is gained.The experiment demonstrates that the speckle interferometry can be better used in dynamic measurement of planer tool. The results are discussed.

关 键 词：激光散斑测试 应力场 刨刀 机床刀具 应力场 

分 类 号：TG716[金属学及工艺—刀具与模具]