微量锆对Cu-P基急冷钎料润湿性的影响  

Influence of micro Zr on Cu-P based quenching filler metal properties and wettability

作　　者：邹家生[1] 王磊[1] 汪成龙[1] 

机构地区：[1]江苏科技大学先进焊接技术省级重点实验室,江苏镇江212003

出　　处：《江苏科技大学学报（自然科学版）》2011年第1期23-26,共4页Journal of Jiangsu University of Science and Technology:Natural Science Edition

基　　金：江苏省自然科学基金项目资助(BK2007097)

摘　　要：采用单辊急冷装置成功制备了4种成分的Cu-P基合金钎料箔带,利用DTA、XRD等分析其熔化特性和结构,并对它在紫铜上的润湿性进行了研究.结果表明:急冷钎料与常规钎料相比,熔化温度低,熔化温度区间窄,其中WZr为0.04%的急冷钎料具有最低的液相线温度和最窄的熔化温度区间,制备的四种急冷钎料基本上均为非晶.在相同工艺条件下,WZr为0.04%的急冷钎料在紫铜上的润湿性最好;随着钎焊温度提高或钎焊时间的增加,Cu-P基急冷钎料的润湿性都出现了先增大后减小的趋势;急冷钎料和常规钎料相比,润湿性明显提高.Four different components of Cu-P based rapidly-cooled foil belt filler metals are prepared by single-roll rapidly-cooled equipment.Melting feature and structure are studied with DTA and XRD methods.Wetting ability of Cu-P based filler metals on copper is analyzed.The results show that compared with the conventional fillers,the quenching fillers have lower melting temperature and narrower melting temperature range.Quenching solder with 0.04wt%Zr has the lowest liquidus temperature and the narrowest melting temperature range.The structures of four quenching fillers are basically amorphous.In the same process conditions,the quenching filler metal with Zr 0.04 wt% has best wettability on copper.Wettability of Cu-P based quenching solder increases firstly and then decreases with the increase of the brazing temperature and time.Compared with conventional brazing filler metals,the wettability of quenching filler metal is improved significantly.

关 键 词：Cu-P基钎料 急冷钎料 熔化温度 钎料结构 润湿性 

分 类 号：TG453[金属学及工艺—焊接]