工艺过程对NBT/BaTiO_3复合PTC材料性能的影响  

The Effects of Technology Process on Characteristics of NBT/BaTiO_3 PTC Composites

作　　者：霍伟荣[1] 于天来 王伟宾[1] 曲远方[3] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054 [2]成都光明光电股份有限公司,四川成都610051 [3]天津大学先进陶瓷与加工技术教育部重点实验室,天津300072

出　　处：《压电与声光》2011年第2期254-257,共4页Piezoelectrics & Acoustooptics

摘　　要：采用传统陶瓷工艺制备了Na0.5Bi0.5TiO3（NBT）/BaTiO3复合PTC材料,通过对样品性能测试及扫描电子显微镜（SEM）形貌分析研究了工艺过程对NBT/BaTiO3复合PTC材料性能的影响,研究结果表明,NBT的加入方式影响复合PTC材料的半导化,而成型压力影响试样的气孔率,进而影响材料的PTC效应和室温电阻率,最佳的工艺过程为：NBT在二次料中加入,成型压力为298 MPa,烧结温度范围为1 275~1 290℃。The Na0.5Bi0.5TiO3（NBT）/BaTiO3 PTC composites were prepared by the conventional ceramic processing technology.The effects of technical process on the characteristics of NBT/BaTiO3 PTC composites were investigated by testing the performance of the sample and the scanning electron microscopy（SEM） analysis.It was found that the adding sequence of NBT could influence on the semiconductorizing of PTC compsotes.The porosity of the sample was influenced by the shaping pressure,and thus the PTC effects and the room temperature resistivity were influenced.The optimal technical process was that NBT was added in the second material,the shaping pressure was 298 MPa,and the sintering temperature range was from 1 275 ℃ to 1 290 ℃.

关 键 词：BATIO3基 Na0.5Bi0.5TiO3(NBT) 加料顺序 成型压力 烧结温度 PTC效应 

分 类 号：TN304[电子电信—物理电子学] TQ174[化学工程—陶瓷工业]