添加剂对PCB酸性铜镀层质量及镀液性能影响  

Influences of Additives on Coating Quality and Bath Performance in Acid Copper Plating of PCB

作　　者：肖发新[1,2] 曹岛[1] 孟志广[1] 毛建伟[1] 杨涤心[1] 申晓妮[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]河南科技大学河南省有色金属材料科学与加工技术重点实验室,河南洛阳471003

出　　处：《中国表面工程》2011年第2期74-79,共6页China Surface Engineering

基　　金：国家青年自然科学基金(50904023);河南省教育厅自然科学研究基金(2010B450001)

摘　　要：采用霍尔槽法、电化学、SEM、XRD等方法研究了添加剂浓度对酸性铜镀层质量及镀液性能的影响。试验表明,随着添加剂BSP、PPNI、ABSS、PN加入量增大,镀层光亮区和镀液分散能力先增大后减小,其适宜的浓度分别为24 mg/L、20 mg/L、0.02 mL/L、20 mg/L。在适宜的工艺条件下施镀15 min所得镀层光亮平整,光亮区为0.6～9.8 cm,对应电流密度0～13.38 A/dm2。镀液分散能力可达到95.1%,深镀能力L/φ至少可到5。在1～4 A/dm2下电流效率几乎为100%。混合添加剂使铜阴极峰电位负移80 mV,峰电流由43 A/cm2降至37 A/cm2。SEM试验表明镀层光滑平整、结晶细小均匀,XRD表明镀层为面心立方Cu,且在(111)晶面择优取向。该工艺具有电流密度及温度范围宽的特点,适合于PCB酸性镀铜生产。The influences of additives concentrations on Cu coating quality,performance of bath were investigated using hull cell method,electrochemical technique,SEM and XRD,et al.It was found that the bright areas and throwing power of bath increase firstly and decrease afterwards with the increase of additive concentration of BSP,PPNI,ABSS and PN,and its concentrations is 24 mg/L,20 mg/L,0.02 mL/L and 20 mg/L,respectively.A bright and glossy coating is obtained after plating for 15 min under appropriate conditions.The bright area of coating is 0.6~9.8 cm,which accords to the current density region of 0~13.38 A/dm2.The throwing power of bath reaches 95.1 % and the ability of deep plating L/φ reaches 5.The current efficiency is almost 100 % under the current density region of 1~4 A/dm2.The cathodic peak current of copper electrodepositing decreases from 43 to 37 mA/cm2 and the peak potential shifts negatively by 80 mV under the function of mixed additives.The crystal of coating is superfine and mainly assigned to the（111） crystal face.The process can be used for PCB copper plating production due to the wide range of current density and temperature.

关 键 词：添加剂 PCB 酸性镀铜 镀层质量 镀液性能 

分 类 号：TQ153.14[化学工程—电化学工业]