晶振加工过程中磨削系统优化设计  

Optimization Design of Grinding System on Crystal Oscillator Processing

作　　者：于宏新[1] 杨向萍[1] 徐志虎[1] 韩朋朋[1] 

机构地区：[1]东华大学机械工程学院,上海201620

出　　处：《轻工机械》2011年第2期112-115,共4页Light Industry Machinery

摘　　要：利用CAXA软件绘制晶振磨削机构简图,并使用ANSYS分析软件对现有设备的磨削机构进行ANSYS分析,对相等磨削接触力的情况下不同的磨削角度产生的最大应力做比较,在机构的运动传递中引入阻尼元件,实现刚性到柔性的转化。分析结果表明,磨削角度的改进和阻尼元件的引入,减少了石英音叉的磨削硬性冲击,减少断片率,也简化了进给调速的控制。CAXA software is used to draw structure diagrams for crystals grinding institutions and ANSYS software is used to analyze the stress of the existing grinding institutions,then the design compares with the maximum stress caused by different grinding angles on the same case of equal contact force and realizes the transformation of flexibility and rigidity due to introduction damping devices.The results show that the improvement of grinding angle and the introduction of damping devices not only greatly reduce rigid impact of the quartz tuning fork and the fragmentation rate,but also simplify the feed speed control.[Ch,10 fig.1 tab.9 ref.]

关 键 词：电子元件 晶体振荡器 ANSYS软件 柔性冲击 粗精磨 

分 类 号：TN752.2[电子电信—电路与系统]