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作 者:GUO BaoQiao XIE HuiMin ZHU JianGuo WANG HuaiXi CHEN PengWan ZHANG QingMing
机构地区:[1]Key Laboratory of Applied Mechanics, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China [2]State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, China
出 处:《Science China(Physics,Mechanics & Astronomy)》2011年第4期574-580,共7页中国科学:物理学、力学、天文学(英文版)
基 金:support by the National Basic Research Program of China(Grant Nos. 2010CB631005 and 2011CB606105);the National Natural Science Foundation of China(Grant Nos. 10625209,10732080 and 90916010);China Postdoctoral Science Foundation(Grant No. 20090460335);Specialized Research Fund for the Doctoral Program of Higher Education(Grant No. 20090002110048);the opening funds from the State Key Laboratory of Explosion Science and Technology(Grant No. KFJJ10-18Y)
摘 要:The shear modulus of the adhesive layer and the failure mode of adhesive structure on single lap joint specimens under tensile tests are investigated in this paper.The aluminum-aluminum adherends are bonded by two different adhesives:polydimethylsiloxane (PDMS) and epoxy.The full deformation fields are measured using the digital image correlation (DIC) method with the images on the middle part of the adhesive layer recorded by a high resolution microscope.Then,the shear modulus values of the two adhesives are calculated with a simple pure shear strain model.A numerical model is proposed to simulate the single lap joint structure under tensile load in comparison with the experimental results.The results show that this method can successfully estimate the shear modulus of the adhesive layer.The failure behavior of epoxy adhesive/adherend interface is also analyzed and discussed.The shear modulus of the adhesive layer and the failure mode of adhesive structure on single lap joint specimens under tensile tests are investigated in this paper. The aluminum-aluminum adherends are bonded by two different adhesives: polydimethyl- siloxane (PDMS) and epoxy. The full deformation fields are measured using the digital image correlation (DIC) method with the images on the middle part of the adhesive layer recorded by a high resolution microscope. Then, the shear modulus values of the two adhesives are calculated with a simple pure shear strain model. A numerical model is proposed to simulate the sin- gle lap joint structure under tensile load in comparison with the experimental results. The results .show that this method can successfully estimate the shear modulus of the adhesive layer. The failure behavior of epoxy adhesive/adherend interface is also analyzed and discussed.
关 键 词:single lap joint shear modulus adhesive interface FAILURE digital image correlation
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