电流密度对银纳米晶镀层微观结构及显微硬度的影响  

Effect of current density on microstructure and microhardness of nanocrystalline silver film

作　　者：王姗姗[1] 祝要民[1] 任凤章[1,2] 赵士阳[2] 田保红[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]河南省有色金属材料科学与加工技术重点实验室,河南洛阳471003

出　　处：《电镀与涂饰》2011年第4期5-8,共4页Electroplating & Finishing

基　　金：国家自然科学基金(50771042);河南省基础与前沿技术研究计划(092300410064);河南省科技创新人才计划(104100510005);河南省高校科技创新人才支持计划(2009HASTIT023)

摘　　要：在硫代硫酸盐体系(无氰)下电沉积制备了银纳米膜,研究了电流密度对电沉积银纳米膜的电流效率、结合强度、微观形貌、晶粒尺寸、织构及显微硬度的影响。镀液组成为:硝酸银44g/L,硫代硫酸钠220g/L,焦亚硫酸钾44g/L,醋酸铵30g/L,硫代氨基脲0.8g/L。结果表明:在电流密度为0.20～0.35A/dm2时,镀层与基体结合良好,电流效率随电流密度的增大而先增加再减小,(111)晶面的择优取向程度逐渐减弱,(222)晶面织构增强,晶粒尺寸略有增加,显微硬度稍有减小。Nanocrystalline silver deposits were prepared by electrodeposition in a cyanide-free thiosulfate system.The bath composition is as follows：silver nitrate 44 g/L,sodium thiosulfate 220 g/L,potassium metabisulfite 44 g/L,ammonium acetate 30 g/L,and aminothiourea 0.8 g/L.The effect of current density on current efficiency,adhesion,morphology,grain size,structure and microhardness of Ag film was studied.The results showed that when the current density is increased from 0.20 to 0.35 A/dm^2,the adhesion is good,the current efficiency is increased initially then decreased,the preferential orientation is changed from （111） to （222）,the grain size is increased and the microhardness is decreased slightly.

关 键 词：银镀层 纳米晶 电流密度 电流效率 形貌 织构 显微硬度 

分 类 号：TG174.441[金属学及工艺—金属表面处理]