叠层片式铁氧体电感器银端电极匹配研究  

Research of silver termination electrode paste for MLCI

作　　者：许杨生 高永毅 王昕 丁晓鸿 杨邦朝[2] 

机构地区：[1]深圳振华富电子有限公司,广东深圳518109 [2]电子科技大学微电子与固体学院,四川成都610054

出　　处：《电子元件与材料》2011年第5期42-45,共4页Electronic Components And Materials

基　　金：贵州省火炬计划资助项目(No.黔科合G字(2006)5007)

摘　　要：通过对比实验,运用扫描电子显微镜分析了银端电极烧银后的显微结构,并用能谱分析仪对三种烧银后的银端电极进行成分分析,找出与自主研发的叠层片式铁氧体电感器用软磁铁氧体粉料相匹配的银端浆。实验结果和工艺验证表明:Ⅲ号ML78银端浆具有直流电阻低(≤0.61Ω)、温升低(≤16.2℃)等特点,完全满足MLCI批量化生产的要求。By the contrast of experiment,the microstructure and components of three kinds of silver termination electrode sintered were studied with SEM and EDS to find out the sliver termination paste matching the independent research and development of soft ferrite materials for multilayer soft ferrite chip inductors.Results indicate that the No.Ⅲ（ML78） silver termination paste for electrode of MLCI has low direct current resistance（≤0.61Ω） and temperature rise（≤16.2 ℃）,etc.and is well fit for mass production of MLCI.

关 键 词：MLCI 微观结构 成分分析 银端浆 

分 类 号：TN604[电子电信—电路与系统]