环氧树脂灌封材料的增韧研究  

Improving the toughness of epoxy resin encapsulating materials

作　　者：张凯[1] 范敬辉[1] 马艳[1] 黄琨[1] 

机构地区：[1]中国工程物理研究院总体工程研究所,四川绵阳621900

出　　处：《电子元件与材料》2011年第5期65-67,共3页Electronic Components And Materials

基　　金：国防军工计量资助项目(No.2009JS.2.3)

摘　　要：抗冲击精密电子元器件用灌封材料往往需要具有好的韧性。在综合考虑灌封材料力学性能与灌封工艺性的基础上,采用自制带液晶基团聚酯型环氧树脂对环氧树脂E—51进行了增韧改性研究。结果表明,优化配方的增韧型环氧树脂灌封材料在保持自身较高压缩强度的同时,抗冲击强度提高了4.1倍,且具有良好的灌封工艺性,其在25℃条件下的适用期(凝胶化时间)≥100 min。High toughness is always required for encapsulating materials used for the anti-impact precision electronic components and devices.The effects of addition of a kind of self-synthesized polyester epoxy resin containing liquid crystal groups on improving the toughness of epoxy resin E—51 were studied,while changes in the workability of epoxy resin E—51 were also investigated.The results show that the optimized epoxy resin encapsulating material shows little change in compressive strength but significant increase（by 4.1 times） in impact strength in compassion to pure epoxy resin E—51,and exhibits good workability with the gelation time at room temperature（25 ℃） above 100 minutes.

关 键 词：环氧树脂 灌封材料 增韧 改性 

分 类 号：TN604[电子电信—电路与系统]