Sn基焊料/Cu界面IMC形成机理的研究进展  

Progress of study on formation mechanism of IMC at the interface between the Sn-based solder and Cu substrate

作　　者：刘雪华[1,2] 唐电[1] 

机构地区：[1]福州大学材料研究所,福建福州350000 [2]福建工程学院材料科学与工程系,福建福州350000

出　　处：《电子元件与材料》2011年第5期72-76,共5页Electronic Components And Materials

基　　金：国家"863"资助项目(No.2007AA03Z325);福建省发改委"发明创造"专项资助项目

摘　　要：锡基无铅焊料和Cu基材界面间容易形成Cu6Sn5、Cu3Sn及其他金属间化合物(IMC),而IMC将剧烈地影响焊接接头的性能,故对其的研究有助于了解IMC形成的本质,从而控制其形成和长大,以改善接头性能。综述了近期的研究结果,指出Cu6Sn5易形成扇贝状,而Cu3Sn常常为薄层状;其形成过程在固–固界面和固–液(焊料)界面上具有不同特点。热力学分析指出,IMC形成受扩散控制,不同的合金元素可改变IMC的形成驱动力△ G,对其形成和生长有不同的影响。无铅焊料与传统Pb-Sn焊料相比,更易产生IMC,也更易导致接头早期失效。The brittle Cu6Sn5 and Cu3Sn etc.are common intermetallic compounds（IMC） forming at the Sn-based lead-free solder/Cu substrate interface.The Cu6Sn5 and Cu3Sn layers will strongly influence the mechanical behavior and reliability of solder joints,the studies of IMC can help to understand its forming nature,then to control its form and growth,so as to improving properties of solder joints.The near study results are reviewed,in most cases,Cu6Sn5 precipitates in scallop-shaped grains either at the S-L（solid/liquid） interface or the S-S interface,while Cu3Sn is always uniform thin layer.Thermodynamic studies show that the formation of IMC is controlled by diffusion.Different alloy element has unlike effect on the formation and growth of the Cu6Sn5 through changing the driving form force ΔG of it.In contrast to conventional Pb-Sn solders,lead-free solders are easier to form IMC,which results in premature failures of solder joints.

关 键 词：Sn基无铅焊料 金属间化合物 综述 可靠性 

分 类 号：TM277[一般工业技术—材料科学与工程]