填充型导热高分子复合材料研究进展  

Research Progress of Thermal Conductive Polymer Composites with Fillers

作　　者：刘汉 吴宏武 

机构地区：[1]华南理工大学聚合物新型成型装备国家工程研究中心聚合物成型加工教育部重点实验室,广东广州510640

出　　处：《塑料工业》2011年第4期10-13,共4页China Plastics Industry

摘　　要：综述了国内外导热绝缘填料、导热非绝缘填料和混杂填料填充的导热高分子材料的研究进展。简要地介绍了导热高分子材料的导热机理。分析了导热高分子复合材料目前存在的一些问题,并对其研究方向给出了一些建议。The development of thermal conducting polymer composites filled with thermally conductive and insulating filler, thermal conducting and electric filler or hybrid filler were reviewed. The thermal-conducting mechanism was briefly introduced. Some problems existing in thermal-conducting polymer-based composites were discussed and some suggestions were advocated.

关 键 词：热导率 填料 导热高分子材料 导热机理 

分 类 号：TB332[一般工业技术—材料科学与工程]