主绝缘板树脂传递模塑技术研究  

Study on the Technique of the RTM For the Main Insulation Board

作　　者：丁立波[1] 

机构地区：[1]白城职业技术学院,吉林白城137000

出　　处：《塑料工业》2011年第4期52-53,57,共3页China Plastics Industry

摘　　要：首先建立轻轨铁路绝缘器主绝缘板的树脂传递模塑充模过程的三维数学模型,然后对该模型进行了数值模拟分析,研究注射压力、树脂黏度等参数对成型过程的影响,最后提出了消除气泡缺陷的工艺条件。Firstly built a three-dimensional mathematical model of the resin transfer molding （RTM） filling process for main insulation board of insulator of the light rail, then numerical simulate analysis on the model was took. The effect of the parameters such as the injection pressure, resin viscosity on the molding process was studied. Finally, the molding process condition to reduce the gas bubble was optimized.

关 键 词：轻轨铁路 绝缘器主绝缘板 树脂传递模塑 数值模拟 

分 类 号：TQ320.66[化学工程—合成树脂塑料工业]