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作 者:郭宇航[1] 支海军[1] 吕秀芬[1] 师学礼[1]
机构地区:[1]江苏科技大学先进焊接技术省级重点实验室,镇江212003
出 处:《机械工程材料》2011年第3期79-82,99,共5页Materials For Mechanical Engineering
摘 要:采用布氏硬度计、涡流导电仪和扫描电子显微镜等研究了固溶温度、时效及时效前冷变形量对CuNiSiCrRE合金显微组织和性能的影响,在此基础上确定了其最佳热处理工艺。结果表明:该合金的最佳热处理工艺为900℃×1.5 h固溶水冷+40%的冷变形+480℃×2h时效空冷,其相应的硬度为229HB,电导率为45.6%IACS,抗拉强度为674MPa,屈服强度为641MPa,伸长率为16%,软化温度为540℃,拉伸断口为韧性断裂。By means of Brinell hardness tester and eddy-current conductometer as well as SEM, the effects of solid solution temperature, aging and cold deforming before aging on microstructure and properties of the CuNiSiCrRE alloy were studied, then the optimum heat treatment was determined. The results show that the optimized heat treatment process was solution at 900℃ for 1. 5 h with cooling in water, 40% cold-working and aging at 480℃ for 2 h with cooling in air. The hardness was 229 HB, electrical conductivity was 45. 6% IACS, tensile strength reached 674 MPa, yield strength was 641 MPa, elongation was 16% and softening temperature was 540℃. Tensile fracture was ductile fracture.
关 键 词:CuNiSiCrRE合金 硬度 时效 电导率
分 类 号:TG166.2[金属学及工艺—热处理]
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