间位双酚A型聚酰亚胺薄膜的制备与性能研究  

Preparation and Property Study of m-Bisphenol A Polyimide Films

作　　者：周超[1] 许梅芳[1] 虞鑫海[1] 

机构地区：[1]东华大学应用化学系,上海201620

出　　处：《绝缘材料》2011年第2期21-25,29,共6页Insulating Materials

基　　金：上海市博士后基金重点项目(09R21421000)

摘　　要：将间位双酚A二胺单体2,2-双[4-(3-氨基苯氧基)苯基]丙烷(3BAPOPP)和4,4-二氨基二苯醚(44ODA)分别与不同的酸酐聚合制得聚酰胺酸溶液,再经热亚胺化制得间位双酚A型聚酰亚胺薄膜,研究聚合物主链中引入间位取代含有-O-键柔性链对薄膜性能的影响。结果表明,与传统含有刚性链结构的PI薄膜相比,含柔性链的PI薄膜具有较低的玻璃化转变温度(Tg),且薄膜的初始热分解温度仍然保持在500℃以上,达到了改善加工性能的目的。Polyamide acid solution was prepared by polymerization reaction with m-bisphenol A diamine monomer 2,2-bis[4-（3-aminophenoxy）phenyl] propane（3BAPOPP）,4,4-diamino diphenyl ether（44ODA）,respectively and various anhydride.Then m-bisphenol A polyimide film was prepared by imidized process.The effects of polymer main chain with introduction of meta position to substitute flexible chain with-O-bond on the film＇s properties were studied.The results show that the glass transition temperature（Tg） of PI films with flexible chain is lower than that of the conventional PI films with rigid chain structure,and the initial thermal decomposition temperature of the film remain 500 ℃ above,achieving the purpose of improving processability.

关 键 词：2 2-双[4-(3-氨基苯氧基)苯基]丙烷 聚酰亚胺薄膜 热稳定性 表面性能 

分 类 号：TM215.3[一般工业技术—材料科学与工程] TQ323.7[电气工程—电工理论与新技术]