微量合金元素对Cu-Ni-Si合金组织和性能的影响  

Effect of Trace Element on Microstructure and Properties of Cu-Ni-Si Alloy

作　　者：张毅[1] 刘平[2] 田保红[1] 贾淑果[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]上海理工大学机械工程学院,上海200093

出　　处：《热加工工艺》2011年第6期11-14,共4页Hot Working Technology

基　　金：国家自然科学基金资助项目(50571035);国家高新技术研究发展计划(863计划)资助项目(2006AA03Z528);河南省杰出青年基金资助项目(0521001200)

摘　　要：研究了微量合金元素Ag、P对Cu-Ni-Si合金组织和性能的影响。结果表明:微量的合金元素Ag、P的加入使Cu-Ni-Si合金出现严重的晶格畸变,起到了有效的细化晶粒的作用,同时能有效地提高Cu-Ni-Si合金的抗拉强度、电导率以及显微硬度。在450℃时效2 h,加入0.15%Ag使其导电率提高15.3%;加入0.03%P使其显微硬度和抗拉强度分别提高18.6%和29.8%。同时Cu-Ni-Si合金中加入微量合金元素Ag、P能明显地抑制Cu-Ni-Si合金的再结晶过程,并能细化该合金的再结晶晶粒。The effects of trace Ag and P on the microstructure and properties of Cu-Ni-Si alloy were studied. The results indicate that the addition of trace Ag and P in Cu-Ni-Si alloy causes a great lattice distortion, the refining grain effect is obtained. The tensile strength, electrical conductivity and microhardness are effectively increased. With the 0.15%Ag addition, the electrical conductivity can increase 15.3% alter aging at 450 ℃ × 2h. With the 0.03%P addition, the microhardness and tensile strength Can increase 18.6% and 29.8% after aging at 450 ℃ × 2 h, respectively. The recrystallization process is obviously controlled and the recrystallization grain is effectively refined with the addition of trace Ag and P.

关 键 词：CU-NI-SI合金 抗拉强度 显微硬度 电导率 再结晶 

分 类 号：TG146.11[一般工业技术—材料科学与工程]